Qualcomm Snapdragon 845

Qualcomm Snapdragon 845
Qualcomm Snapdragon 845는 삼성 2세대 10nm process를 사용하였고, Kyro 385를 사용하였다. Kyro 385는 big 계열 Cortex-A 75 / LITTLE 계열 Cortex-A 55를 Semi custom하였다.

CPU Core:
big: Kyro 385 Gold x 4(Cortex-A 75 semi custom) @ 2.8GHz, Private L2 256KB x 4
LITTLE: Kyro 385 Silver x 4(Cortex-A55 semi custom) @ 1.77GHz, Private L2 128KB x 4
DSU, DynamiQ, L3 2MB.

GPU(Graphics Processor Unit): Qualcomm Adreno 630.

Interconnect:

Memory: Dual Channel LPDDR4x @ 1866MHz, System Level Cache: 3MB.

LTE: Cat18(downlink)/13(uplink) Peak Down/Up(1.2Gbit/s/150Mbit/s).

DSP: Qualcomm Hexagon 685 DSP
Video: 4K video decoder @ H.265.

ISP(Image signal processo):

Storage: UFS(UFS2.1 Gear32L),
SD(SD3.0 UHS-I)